Also this year you will find us from 05. 06 to 07. 06. 2018 at SMT Hybrid Packaging, Europe’s leading event for system integration in microelectronics.
Be there when the industry meets. At the SMT you will see innovative products, future trends and will receive a wide range of
Service offers. In addition, discuss new ways of solving problems, from the idea to the development to
to the production of electronic assemblies.
Come by and convince yourself of the advantages of the KlettWelding process.
You will find us at booth 5-427. We are looking forward to seeing you.