If the components can be briefly exposed to a temperature of 200°C, the connection can also be made with a one-sided coating. The KlettSintering achieves similar tensile and shear strengths as the KlettWelding. Especially if one of the two joining partners can only be coated in a complex process, this process offers clear advantages.
The KlettSintering Tape can be used to avoid having to coat either of the two joining partners. As with double-sided adhesive tape, a metal foil coated on both sides is inserted between the two components. By simply pressing together, a double Velcro sintering process takes place at 200°C. The two-sided adhesive tape is then inserted between the two components.
Properties of the connection :
|Necessary bond force||1 – 70 MPa|
|Shear strength||up to approx. 30 MPa|
|KlettSinteringtemperature||up to max. 210°C|
|Bond time||60 s bis 5 min|
|Contact resistance||< 100 mΩ|
|Planarity requirement||approx. 10 µm|
|Wire material||Copper , Gold.|
|Resulting contact height||< 10 µm|
|Substrate materials usable||
Ceramics (LTTC), polymer (PI, PCB), glass.